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N-heptane Cleaning Agent

N-heptane Purity: ≥99% CAS No.: 110-54-3 Molecular formula: C6H14 Molecular weight: 86.17 Appearance: Colorless transparent liquid with a faint special smell. ...

Release time：2025-04-26

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N-heptane

Purity: ≥99%

CAS No.: 110-54-3

Molecular formula: C6H14

Molecular weight: 86.17

Appearance: Colorless transparent liquid with a faint special smell.

Melting point: -95.6℃

Boiling point: 68.7℃

Relative density (water = 1): 0.66

Relative vapor density: (air = 1): 2.97

Saturated vapor pressure (kPa): 13.33 (15.8℃)

Flash point: -25.5℃

Solubility: Insoluble in water, soluble in most organic solvents such as ethanol and ether.

Uses of n-heptane:

1. Optical and photoelectric glass industry: wipe dirt on the surface of LCD screens, watch surfaces, mobile phone lenses (glass, acrylic and coating), filters, etc.;

2. Printing industry: mainly used to clean dirt such as ink and glue on printing equipment and rollers and knives; wipe the appearance of product printing and packaging (fingerprints, dust, oil, etc.);

3. Electronics industry: can be used to remove PCB flux residues, fingerprints, and solder mask;

4. Metal industry: can be used for surface oil, dust, fingerprints, etc. of various metal materials.

5. Clothing, leather and leather goods industry: can replace gun water, gun oil, etc. for wiping and splashing to clean dust and dirt on the surface of various fabrics and leather goods.

N-heptane belongs to hydrocarbon solvents and can be used as electronic cleaning solvents, but it is generally not used alone. Generally, electronic cleaning agents use mixed hydrocarbon solvents, of course, other halogenated hydrocarbons, alcohols, ketones, esters, fluorine-containing chlorine and bromine solvents.

N-heptane Cleaning Agent belongs to the field of electronic industry cleaning production technology. It uses sodium ethylenediaminetetraacetate and soluble fluoride as main agents, alcohol ether and phenol ether surfactants as cleaning agents, amine soap and amide as synergists, alcohols and deionized water as solvents. The weight percentage of each component is: sodium ethylenediaminetetraacetate 0.1-1%, alcohol ether surfactant 6-15%, phenol ether surfactant 3-5%, alkyl alcohol amide 3-5%, triethanolamine oleic acid soap 5-10%, alcohol 1-5%, soluble fluoride 0.1-1%, deionized water 58-81.8%. This preparation is used to clean the materials and devices in semiconductor technology, and the surface of glass and metal in thin film technology, so that it has a better cleaning effect.

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